Sunlu – PC-ABS

Material Properties and Performance

SUNLU PC-ABS Black is engineered to deliver superior mechanical performance. The integration of PC and ABS enhances tensile strength and stiffness while maintaining a lightweight profile. Its low hygroscopic nature ensures minimal moisture absorption, leading to consistent print quality and dimensional accuracy. With a heat deflection temperature of up to 102 degrees Celsius, this filament is suitable for components exposed to high temperatures.

Applications

This filament is ideal for producing functional prototypes and end-use parts that require high strength and thermal resistance. Common applications include automotive interior parts such as dashboards and door handles, electronic housings, and industrial tools. Its durability and stability make it suitable for parts subjected to mechanical stress and harsh environments.

Printing and Handling

For optimal results, print SUNLU PC-ABS Black at a nozzle temperature between 260 – 280 degrees Celsius and a bed temperature of 100 – 110 degrees Celsius. A printing speed of 50 – 230 mm/s is recommended. To improve bed adhesion, use a suitable adhesive like PVA glue. Due to its composition, it’s advisable to use an enclosed printer or a heated chamber to maintain consistent ambient temperatures during printing. Additionally, annealing the printed parts can help relieve internal stresses and enhance mechanical properties.

Before printing, ensure the filament is properly dried to prevent moisture-related issues. Dry the filament at 80 degrees Celsius for 24 hours or at 110 degrees Celsius for 4 hours. Proper storage in a dry environment is essential to maintain filament quality.